Wafer Dicing

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The process of Silicon Wafer Dicing made between wafers and dies

Silicon Wafer Dicing is a process by which a separation is made between wafers and dies. This can be done by breaking with the use of a mechanical saw. Recently saws are being replaced with laser cutters for Silicon Wafer Dicing. The chips which come out after the dicing, is encapsulated for usage in computers and other electronic equipments. As dicing process is carried on, the mounted tape with sticky backing holds the dice coming out of wafer. After process of Silicon Wafer Dicing is completed, the dies are placed on printed circuit boards. The tape being sticky the dies derived from wafers remain stuck till the time it is physically extracted by die sorters. With Wafer Dicing Process, being completed dies available could be of various shapes and sizes but normally they are rectangular or square. The process of laser based technique is also called stealth dicing process.

As in
silicon wafer dicing
, the wafers have the highest value at the time of dicing. The idea has to be to increase in number of dies, yield per wafer. There is a system by which assorted semi conductor materials such as silicon and other compound material.

The gap between two dies adjacent to each other can be reduced by using the right saw which leaves the width of the narrow saw. This reduction of width helps in reduction of cost per die.

.

The elimination of wear items and mechanical cutting device reduces further cost.

The automated dicing system can meet the exacting requirement which the mechanical system cannot perform. can be customized too. The highest quality dicing can be achieved by double cutting too. In some cases of lacer dicing thin wafers are perched on films.

Discover Wafer Dicing On eBay Below:

OPERATION MANUAL FOR DISCO WAFER DICING SAW AUTOMATIC CUTTING SAW
OPERATION MANUAL FOR DISCO WAFER DICING SAW AUTOMATIC CUTTING SAW
$50.00
Disco DAD522 Precision Automatic Wafer Dicing Saw
Disco DAD522 Precision Automatic Wafer Dicing Saw
$26,750.00
DISCO NEW 10PC DISCO DIAMOND NBC ZH 2030 SE WAFER DICING BLADE
DISCO NEW 10PC DISCO DIAMOND NBC ZH 2030 SE WAFER DICING BLADE
$249.95
New box of 10 Semitec Wafer Dicing Wheel BladeS1025 218 OD 3 4 ID
New box of 10 Semitec Wafer Dicing Wheel BladeS1025 218 OD 3 4 ID
$35.95
KS 7100AD Precision Wafer Dicing Saw Tag 71
KS 7100AD Precision Wafer Dicing Saw Tag 71
$26,750.00
C128058 KS Kulicke  Soffa 982 6 Wafer Dicing Saw
C128058 KS Kulicke Soffa 982 6 Wafer Dicing Saw
$10,000.00
DISCO NBC ZH NBCZH WAFER DICING WHEEL BLADE
DISCO NBC ZH NBCZH WAFER DICING WHEEL BLADE
$21.00
Used EO Technics LMC3200G2 thin wafer dicing systemlaser grooving
Used EO Technics LMC3200G2 thin wafer dicing systemlaser grooving
$100,000.00
KS 7100AD Precision Wafer Dicing Saw
KS 7100AD Precision Wafer Dicing Saw
$26,750.00
KS 984 6 Precision Wafer Dicing Saw for Hard Materials
KS 984 6 Precision Wafer Dicing Saw for Hard Materials
$18,000.00
6 DISCO DICING SAW CHUCK WAFER WASHER MODEL DCS140 ADT KS DISCO ALUMINIUM 140
6 DISCO DICING SAW CHUCK WAFER WASHER MODEL DCS140 ADT KS DISCO ALUMINIUM 140
$463.99
Disco DAD 2H 6T 6 Automatic Manual Wafer Dicing Saw Scribing Scriber System
Disco DAD 2H 6T 6 Automatic Manual Wafer Dicing Saw Scribing Scriber System
$5,499.99
Kulicke  Soffa KS 7500 Plus Fully Automatic Wafer Dicing Saw System
Kulicke Soffa KS 7500 Plus Fully Automatic Wafer Dicing Saw System
$24,999.99
Disco 5504 Dicing Saw FLANGE  ADT KS SINGLE BLADE CUTTING SILICON WAFER
Disco 5504 Dicing Saw FLANGE ADT KS SINGLE BLADE CUTTING SILICON WAFER
$50.00
Disco 5204 Dicing Saw FLANGE  ADT KS SINGLE BLADE CUTTING SILICON WAFER
Disco 5204 Dicing Saw FLANGE ADT KS SINGLE BLADE CUTTING SILICON WAFER
$50.00
Disco 4844 Dicing Saw FLANGE  ADT KS SINGLE BLADE CUTTING SILICON WAFER
Disco 4844 Dicing Saw FLANGE ADT KS SINGLE BLADE CUTTING SILICON WAFER
$50.00
Thermocarbon DSA 075 15mm Spindle Flange  for Wafer Dicing Saws ADT K
Thermocarbon DSA 075 15mm Spindle Flange for Wafer Dicing Saws ADT K
$50.00
Hardware Vacuum Block NEST PLATFORM Wafer Dicing System 10 x105 Towa 50002342
Hardware Vacuum Block NEST PLATFORM Wafer Dicing System 10 x105 Towa 50002342
$55.00
Hardware Vacuum Block NEST PLATFORM Wafer Dicing System 8 X12 Towa 50003008 PK
Hardware Vacuum Block NEST PLATFORM Wafer Dicing System 8 X12 Towa 50003008 PK
$55.00
Vacuum Block NEST PLATFORM Wafer Dicing System 10X12 Towa 50003050 PKG 3
Vacuum Block NEST PLATFORM Wafer Dicing System 10X12 Towa 50003050 PKG 3
$55.00
DISCO NEW 10PC DISCO DIAMOND NBC ZB 1050 WAFER DICING BLADES BOX OF 10 FREE S H
DISCO NEW 10PC DISCO DIAMOND NBC ZB 1050 WAFER DICING BLADES BOX OF 10 FREE S H
$249.95
Lot of 50  New Dynatex Wafer Grip Adhesives 715 212  for Dicing Wafer Saws
Lot of 50 New Dynatex Wafer Grip Adhesives 715 212 for Dicing Wafer Saws
$95.00
1 Pc DISCO Diamond Wafer Dicing BLADE type NBC ZB 1050 NEW
1 Pc DISCO Diamond Wafer Dicing BLADE type NBC ZB 1050 NEW
$19.95
1 pc DISCO Diamond Wafer Dicing BLADE type NBC ZH 2030 27HCCE B NEW
1 pc DISCO Diamond Wafer Dicing BLADE type NBC ZH 2030 27HCCE B NEW
$29.95
Micro Automation 1100 Dicing SawWafer Dicing Programmable 150mm Dicing saw
Micro Automation 1100 Dicing SawWafer Dicing Programmable 150mm Dicing saw
$9,500.00
Disco 27HCCC NBC ZH2030 Aluminum Hub Diamond Silicon Wafer Dicing Blade
Disco 27HCCC NBC ZH2030 Aluminum Hub Diamond Silicon Wafer Dicing Blade
$6.00
G150685 Kulicke  Soffa 780 Wafer Dicing Saw KS
G150685 Kulicke Soffa 780 Wafer Dicing Saw KS
$7,500.00
5 Pieces DISCO Diamond Wafer Dicing BLADE type NBC ZB 1050 NEW
5 Pieces DISCO Diamond Wafer Dicing BLADE type NBC ZB 1050 NEW
$89.95
5 Pieces DISCO Diamond Wafer Dicing BLADE type NBC ZH 2030 27HCCE B NEW
5 Pieces DISCO Diamond Wafer Dicing BLADE type NBC ZH 2030 27HCCE B NEW
$129.95
Disco Abrasive Systems Wafer Dicing Blade G1A857 SDC320R11B01 8 Pack
Disco Abrasive Systems Wafer Dicing Blade G1A857 SDC320R11B01 8 Pack
$80.00
20 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 104 30 WAFER RING ADT K
20 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 104 30 WAFER RING ADT K
$115.99
20 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 104 30 WAFER RING ADT K
20 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 104 30 WAFER RING ADT K
$115.99
20 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 104 30 WAFER RING ADT K
20 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 104 30 WAFER RING ADT K
$117.99
22 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 45 350 102 WAFER RING ADT K
22 5 DISCO DICING SAW PERFECTION FILM FRAMES FF 45 350 102 WAFER RING ADT K
$129.79
lot of 5 pcs DISCO DIAMOND BLADE ZH05 SD3000 N1 50 WAFER DICING BLADES
lot of 5 pcs DISCO DIAMOND BLADE ZH05 SD3000 N1 50 WAFER DICING BLADES
$70.00
lot of 5 pcs DISCO DIAMOND BLADE ZH05 SD3000 N1 50 N3166 WAFER DICING BLADES
lot of 5 pcs DISCO DIAMOND BLADE ZH05 SD3000 N1 50 N3166 WAFER DICING BLADES
$70.00
INTERCON SBS 8800 	PRECISION AUTOMATIC WAFER DICING SAW DISCO
INTERCON SBS 8800 PRECISION AUTOMATIC WAFER DICING SAW DISCO
$13,000.00
Micro Automation Dicing Saw MA1100Wafer saw Silicon Saw
Micro Automation Dicing Saw MA1100Wafer saw Silicon Saw
$9,500.00
Wafer dicing grip ring 6 OD for 4 or smaller wafers
Wafer dicing grip ring 6 OD for 4 or smaller wafers
$2.00

Recently Purchased Wafer Dicing:


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